Please use this identifier to cite or link to this item:
http://nopr.niscpr.res.in/handle/123456789/13989| Title: | A comparison of lifted lead defect inspection system for surface mount technology |
| Authors: | Ramli, Rizauddin Wahab, Dzuraidah Abd Ghani, Jaharah Abd Zain, Raime M |
| Keywords: | Lifted lead defect;Surface mount technology (SMT);Vision camera |
| Issue Date: | May-2012 |
| Publisher: | NISCAIR-CSIR, India |
| Abstract: | This study presents development of an automated lead defect inspection system by using Visual Mechanical Inspection Scanner (VMIS) in semiconductor industry. In any device seated out of cavity, VMIS detects misplacement error (ME), a quality defect in surface mount technology (SMT). ME causes a lifted lead defect on lead packages. MEs that can be analyzed are of two kinds: i) device seated out of cavity; and ii) double devices imbedded in the same cavity. The system was successfully tested on devices with 90% accuracy of inspection. Thus VMIS can inspect device seated out of cavity and hence prevents lifted lead from occurring. |
| Page(s): | 330-333 |
| ISSN: | 0975-1084 (Online); 0022-4456 (Print) |
| Appears in Collections: | JSIR Vol.71(05) [May 2012] |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| JSIR 71(5) 330-333.pdf | 115.94 kB | Adobe PDF | View/Open |
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