Anodic corrosion of copper in presence of aniline derivatives

Abstract

The rates of anodic corrosion of copper plates in different concentrations of phosphoric acid (6, 8, 10, 12 and 14 mol) have been studied by measuring the limiting current of anodic dissolution. The rates of corrosion are measured in absence and presence of aniline derivatives, such as aniline, <i>p</i>-bromoaniline, <i>m</i>-chlororaniline, <i>o</i>-chlororaniline, <i>p</i>-chlororaniline and <i style="mso-bidi-font-style:normal">p</i>-methyl aniline. It is found that the rate of corrosion depends on the type of <span style="mso-bidi-font-weight:bold">inhibitor and its concentration. The rate of corrosion decreases by increasing the amount of inorganic additives from 9.72% to 80.14 %, depending on organic compounds and their concentrations. These compounds verify Langmuir and Flory-Huggins isotherm. Thermodynamic parameters are also reported.<span style="mso-bidi-font-weight: bold">

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