Please use this identifier to cite or link to this item: http://nopr.niscpr.res.in/handle/123456789/1793
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dc.contributor.authorHsieh, Kun-Lin-
dc.date.accessioned2008-08-04T11:21:24Z-
dc.date.available2008-08-04T11:21:24Z-
dc.date.issued2008-07-
dc.identifier.issn0022-4456-
dc.identifier.urihttp://hdl.handle.net/123456789/1793-
dc.description505-511en_US
dc.description.abstractThis study presents applications of dimensional analysis (DA) and artificial neural networks (ANNs) for constructing model in many applications in chemistry, physics and mechanics. An illustrative example for spin coating of thin films in IC manufacturing is employed to demonstrate rationality and effectiveness of proposed approach.en_US
dc.language.isoen_USen_US
dc.publisherCSIRen_US
dc.sourceJSIR Vol.67(7) [July 2008]en_US
dc.subjectArtificial neural networksen_US
dc.subjectDimensional analysisen_US
dc.subjectDimensionless termsen_US
dc.subjectFunction approximationen_US
dc.titleIncorporating dimensional analysis and artificial neural networks into achieving process modeling in IC manufacturingen_US
dc.typeArticleen_US
Appears in Collections: JSIR Vol.67(07) [July 2008]

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