Please use this identifier to cite or link to this item: http://nopr.niscpr.res.in/handle/123456789/19054
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dc.contributor.authorLina, Jian-Yang-
dc.contributor.authorWang, Bing-Xun-
dc.date.accessioned2013-06-14T05:58:57Z-
dc.date.available2013-06-14T05:58:57Z-
dc.date.issued2013-06-
dc.identifier.issn0975-1017 (Online); 0971-4588 (Print)-
dc.identifier.urihttp://hdl.handle.net/123456789/19054-
dc.description209-212en_US
dc.description.abstractIn this work, intrinsic nanocrystalline silicon (NC-Si) thin film is deposited onto the ITO/glass substrate by PECVD and used as the conduction material for the conductive-bridging random-access memory device. The resistive switching effects of the nanocrystalline silicon thin films are investigated in the memory device. Experimental results have shown the stable bipolar resistive switching of the NC-Si films with a retention time over 104 s. In addition, the current conduction mechanism of the nanocrystalline silicon films is examined with XPS depth-profiling and TEM analyses. It clearly indicates that the conduction mechanism of the resistive switching is the formation of metallic bridges due to the metal cation migration in the nanocrystalline silicon film. en_US
dc.language.isoen_USen_US
dc.publisherNISCAIR-CSIR, Indiaen_US
dc.rightsCC Attribution-Noncommercial-No Derivative Works 2.5 Indiaen_US
dc.sourceIJEMS Vol.20(3) [June 2013]en_US
dc.subjectConductive-bridging random-access memoryen_US
dc.subjectNanocrystalline siliconen_US
dc.subjectIon migrationen_US
dc.subjectResistive switchingen_US
dc.titleResistive switching effects of nanocrystalline silicon films in conductive-bridging random-access memory deviceen_US
dc.typeArticleen_US
Appears in Collections:IJEMS Vol.20(3) [June 2013]

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