Please use this identifier to cite or link to this item: http://nopr.niscpr.res.in/handle/123456789/20964
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dc.contributor.authorVerma, Arun Kumar-
dc.contributor.authorShingweker, A-
dc.contributor.authorNihichlani, M-
dc.contributor.authorSingh, V-
dc.contributor.authorMukhopadhyay, Prantik-
dc.date.accessioned2013-09-04T09:41:38Z-
dc.date.available2013-09-04T09:41:38Z-
dc.date.issued2013-08-
dc.identifier.issn0975-1017 (Online); 0971-4588 (Print)-
dc.identifier.urihttp://hdl.handle.net/123456789/20964-
dc.description283-288en_US
dc.description.abstractCu-30 Zn (wt%) alloy is widely used for cartridge case. As received hot rolled (HR) cartridge brass is rolled about 15%, 30%, 40%, and 50% by plane strain rolling at normal room temperature in laboratory. The quantitative microstructure details such as mean grain size and grain size distribution are characterized by optical microscope equipped with microstructure analysis software. The developments of deformation texture are measured by X-ray texture Goniometer and analysis of texture details is done by LaboTex-Edu texture analysis software. The mean grain size is increased with rolling in rolling direction. The grain size distribution shows higher frequency for larger grains with deformation by rolling. The initial stages of rolling produce bi-modal grain size distribution. Later it shifts to multi-modality. The deformation strengthens Bs, L, R, Goss, Taylor, Cu and S texture components. Though the Cu texture orientation shows an increasing trend, the strength of Cu orientation is much less than that of Bs and S components. The transition of texture for Cu, S and Bs texture components is not found in this study.en_US
dc.language.isoen_USen_US
dc.publisherNISCAIR-CSIR, Indiaen_US
dc.rights CC Attribution-Noncommercial-No Derivative Works 2.5 Indiaen_US
dc.sourceIJEMS Vol.20(4) [August 2013]en_US
dc.subjectRollingen_US
dc.subjectCartridge brassen_US
dc.subjectMicrostructureen_US
dc.subjectTextureen_US
dc.titleDeformation characterization of cartridge brassen_US
dc.typeArticleen_US
Appears in Collections:IJEMS Vol.20(4) [August 2013]

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