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dc.contributor.authorAli, M R-
dc.contributor.authorNishikata, A-
dc.contributor.authorTsuru, T-
dc.date.accessioned2013-10-28T06:49:40Z-
dc.date.available2013-10-28T06:49:40Z-
dc.date.issued2003-01-
dc.identifier.issn0975-0991 (Online); 0971-457X (Print)-
dc.identifier.urihttp://hdl.handle.net/123456789/22693-
dc.description14-20en_US
dc.description.abstractElectrodeposition of aluminum-titanium alloys has been carried out onto platinum and mild steel cathodes from 6.14:3.07:0.09 (mole ratio) AlCl3-BPC-TiCl4 molten bath by controlled-potential and pulse potential methods. High concentration of TiCl4 (>0.1 mol dm-3) interferes with the deposition processes of Al and Al-Ti alloys. The deposition of pure titanium from this electrolyte is difficult, but titanium is co-deposited with aluminum in the form of alloys. The morphologies of the electrodeposited layers have been investigated by X-ray diffractometer and scanning electron microscope. The cathodic current efficiency for the deposition of alloys is about 97%.en_US
dc.language.isoen_USen_US
dc.publisherNISCAIR-CSIR, Indiaen_US
dc.rights CC Attribution-Noncommercial-No Derivative Works 2.5 Indiaen_US
dc.sourceIJCT Vol.10(1) [January 2003]en_US
dc.titleElectrodeposition of Al-Ti alloys from aluminum chloride-N-(n-butyl)pyridinium chloride room temperature molten salten_US
dc.typeArticleen_US
Appears in Collections:IJCT Vol.10(1) [January 2003]

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