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dc.contributor.authorSartale, S D-
dc.contributor.authorLokhande, C D-
dc.date.accessioned2014-02-20T13:05:12Z-
dc.date.available2014-02-20T13:05:12Z-
dc.date.issued2000-01-
dc.identifier.issn0975-1041 (Online); 0019-5596 (Print)-
dc.identifier.urihttp://hdl.handle.net/123456789/26708-
dc.description48-52en_US
dc.description.abstractSuccessive ionic layer adsorption and reaction (SILAR) method was used to deposit cobalt sulphide (CoS) thin films on amorphous glass and Si (III) wafer substrates in aqueous mediumĀ  using cobalt sulphate (CoSO4 ) solution as the cationic precursor and sodium sulphide (Na2S) solution as the anionic precursor. The conditions for the formation of good quantity films such as concentration pH and temperature of anionic and cationic precursor solutions, immersion and rinsing times and number of immersion were optimised. The structural, optimal and electrical properties of the films arc reported.en_US
dc.language.isoen_USen_US
dc.publisherNISCAIR-CSIR, Indiaen_US
dc.rights CC Attribution-Noncommercial-No Derivative Works 2.5 Indiaen_US
dc.sourceIJPAP Vol.38(01) [January 2000]en_US
dc.titleDeposition of cobalt sulphide thin films by successive ionic layer adsorption and reaction (SILAR) method and their characterizationen_US
dc.typeArticleen_US
Appears in Collections:IJPAP Vol.38(01) [January 2000]

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