Please use this identifier to cite or link to this item: http://nopr.niscpr.res.in/handle/123456789/29789
Title: Cure kinetics of epoxy formulations with diaminodiphenyl methane
Authors: Siddararnaiah
Jagadeesh, K S
Prabhakara, G
Issue Date: Jun-1996
Publisher: NISCAIR-CSIR, India
Abstract: The effects of the addition of triglycidyl-p-amino phenol (TGPAP), diglycidyl aniline (DGA) and diglycidyl ether of bisphenol-A (DGEBA) epoxy diluents on the curing behaviour of highly viscous N, N, N', N'-tetraglycidyl-4, 4'-diaminodiphenyl methane (TGDDM) epoxy resin with 4,4'-diamino diphenyl methane (DDM) hardener have been investigated by dynami DSC. Dynamic scans have been carried out over a temperature range of 30-250°C for different resin formulations. The activation energies (Ea) for various epoxy systems have been determined by the Kissenger and Ozawa equations and are in good agreement even for other kinetic parameters. The heat of cure is constant over a wide range of amine concentration. This indicates that any parallel or competing processes which might occur must have comparable heat of reaction.
Page(s): 114-118
ISSN: 0975-1017 (Online); 0971-4588 (Print)
Appears in Collections:IJEMS Vol.03(3) [June 1996]

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