Please use this identifier to cite or link to this item: http://nopr.niscpr.res.in/handle/123456789/32292
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dc.contributor.authorDas, R P-
dc.contributor.authorBhattacharya, M-
dc.contributor.authorJatua, T-
dc.date.accessioned2015-09-15T05:30:36Z-
dc.date.available2015-09-15T05:30:36Z-
dc.date.issued1995-03-
dc.identifier.issn0975-1025 (Online); 0971-0426 (Print)-
dc.identifier.urihttp://hdl.handle.net/123456789/32292-
dc.description1-5en_US
dc.description.abstractAn instrument developed for the evaluation of evenness of jute yarn diameter and thick and thin places employing microprocessor-based technology has been described. The instrument is superior to the existing one in respect of its direct computation and memory capability with digital read-out, giving more accurate results. The values of irregularity parameters (e.g. CV%, thick places and thin places) are all evaluated over the same test piece of the sample yarn. The special features include the programmable selection of test length and the thin place counting facility.en_US
dc.language.isoen_USen_US
dc.publisherNISCAIR-CSIR, Indiaen_US
dc.rights CC Attribution-Noncommercial-No Derivative Works 2.5 Indiaen_US
dc.sourceIJFTR Vol.20(1) [March 1995]en_US
dc.subjectJute yarnen_US
dc.subjectMicroprocessoren_US
dc.subjectThick placeen_US
dc.subjectThin placeen_US
dc.subjectYarn diameteren_US
dc.subjectYarn evenness testeren_US
dc.titleMicroprocessor-based yarn evenness tester and thick and thin place counteren_US
dc.typeArticleen_US
Appears in Collections:IJFTR Vol.20(1) [March 1995]

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