Please use this identifier to cite or link to this item: http://nopr.niscpr.res.in/handle/123456789/41387
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dc.contributor.authorBajpai, A K-
dc.contributor.authorRajpoot, M-
dc.contributor.authorMishra, D D-
dc.date.accessioned2017-04-21T09:15:14Z-
dc.date.available2017-04-21T09:15:14Z-
dc.date.issued1996-07-
dc.identifier.issn0975-0975(Online); 0376-4710(Print)-
dc.identifier.urihttp://nopr.niscair.res.in/handle/123456789/41387-
dc.description560-565en_US
dc.description.abstractThe adsorption of sulphanilamide onto the alumina surface has been carried out from its aqueous solution. It is found that the adsorption follows the Langmuir type process and H-bonding type of forces play a key role in binding the sulphanilamide molecules to the alumina surface. The adsorption increases with increase in pH of the medium. Addition of anions like CI- and SO is also found to affect the adsorption. The adsorption also decreases with increase in temperature. Various kinetic and adsorption parameters such as the adsorption coefficient, rate constants for the adsorption and desorption and surface coverage (q) have been evaluated with the help of a recently proposed kinetic scheme.en_US
dc.language.isoen_USen_US
dc.publisherNISCAIR-CSIR, Indiaen_US
dc.rights CC Attribution-Noncommercial-No Derivative Works 2.5 Indiaen_US
dc.sourceIJC-A Vol.35A(07) [July 1996]en_US
dc.titleAdsorption of sulphanilamide onto the alumina surface from its aqueous solutionen_US
dc.typeArticleen_US
Appears in Collections:IJC-A Vol.35A(07) [July 1996]

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