Cellular automata simulation of dynamic recrystallization in rotary friction welding of pure copper

Abstract

The cellular automata method was introduced to simulate dynamic recrystallization process in rotary friction welding of pure copper, in which the microstructure evolution under different friction welding parameters were simulated. The simulated grain size was well matched with the experiments and the dynamic recrystallization time was comparable to the welding time, which verified the reliability of this model. The relationship between the simulated recrystallized grain size <em>d</em>_s and the Zener-Hollomon parameter can be regressed as <em>d</em>_s=5.44-0.11ln<em>Z</em>.