Please use this identifier to cite or link to this item: http://nopr.niscpr.res.in/handle/123456789/43691
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dc.contributor.authorLee, Yen-Chun-
dc.date.accessioned2018-03-06T09:15:48Z-
dc.date.available2018-03-06T09:15:48Z-
dc.date.issued2018-03-
dc.identifier.issn0975-1084 (Online); 0022-4456 (Print)-
dc.identifier.urihttp://nopr.niscair.res.in/handle/123456789/43691-
dc.description168-171en_US
dc.description.abstractMicroelectromechanical system (MEMS) devices are typically combined with integrated circuits (ICs) for operation in electronic systems. A variety of possible factors could affect the decisions of integrating MEMS and IC components. This paper aimed to investigate the critical influence factors of MEMS and IC integration technologies through expert interviews, and to further analyze their causal relationships based on fuzzy decision-making trial and evaluation laboratory (fuzzy DEMATEL) method. We found that product footprints and product costs are the two major influence dispatchers in the cause group, while fabrication complexity is the major influence receiver in the effect group. Moreover, signal path length has very little strength of influence on other factors. The research analysis of fuzzy DEMATEL method could serve as a reference to future development strategies in the field of MEMS and IC integration technologies.en_US
dc.language.isoen_USen_US
dc.publisherNISCAIR-CSIR, Indiaen_US
dc.rights CC Attribution-Noncommercial-No Derivative Works 2.5 Indiaen_US
dc.sourceJSIR Vol.77(03) [March 2018]en_US
dc.subjectMEMSen_US
dc.subjectIC Integrationen_US
dc.subjectFuzzy DEMATELen_US
dc.subjectInfluence Factoren_US
dc.subjectExpert Interviewsen_US
dc.titleInfluence Factor Analysis of MEMS and IC Integration Technologiesen_US
dc.typeArticleen_US
Appears in Collections:JSIR Vol.77(03) [March 2018]

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