Please use this identifier to cite or link to this item: http://nopr.niscpr.res.in/handle/123456789/5134
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dc.contributor.authorMishra, S-
dc.contributor.authorPatil, I D-
dc.contributor.authorDeore, Dipak-
dc.date.accessioned2009-07-03T14:02:52Z-
dc.date.available2009-07-03T14:02:52Z-
dc.date.issued2005-09-
dc.identifier.issn0975-1084 (Online); 0022-4456 (Print)-
dc.identifier.urihttp://hdl.handle.net/123456789/5134-
dc.description684-687en_US
dc.description.abstractThe effect of sodium and potassium (20-100 ppm) salts of polyacrylic acid (PAA) was determined on mild steel (MS) and copper (Cu) metals by immersing in Jalgaon ground water for 4-24 h in reflux condition (100 °C) and from 5-30 days in ambient condition. The salt deposition on MS and Cu plates was compared with and without polymer addition in water. The salt deposition on MS and Cu increases with increase in time in hot and cold water without addition of polymer. On addition of polymer, with increase in concentration in water, the salt deposition decreases. In cold water on MS, salt deposition is more than Cu, while in hot water it is vice-versa. With increase in the reflux time (4-24 h), salt deposition on Cu and MS increases up to 6 h of reflux time for all concentrations of K salt of PAA and further it decreases from 12 to 24 h. For Na salt of PAA, deposition increases for the lower concentrations (up to 40 ppm), up to 12 h of reflux time and further the deposition decreases for both MS and Cu. At higher concentrations (100 ppm), Na salt of PAA in water is more effective than K salt as the deposition becomes negligible on Cu.en_US
dc.language.isoen_USen_US
dc.publisherCSIRen_US
dc.relation.ispartofseriesD21H21/38en_US
dc.sourceJSIR Vol.64(09) [September 2005]en_US
dc.subjectPolyacrylic aciden_US
dc.subjectMild steelen_US
dc.subjectCopperen_US
dc.subjectSodiumen_US
dc.subjectPotassiumen_US
dc.subjectSalt depositionen_US
dc.titleStudy on sodium and potassium salts of polyacrylic acid as corrosion inhibitorsen_US
dc.typeArticleen_US
Appears in Collections:JSIR Vol.64(09) [September 2005]

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