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http://nopr.niscpr.res.in/handle/123456789/59731| Title: | Effect of clay minerals on copper reclamation from leached solution |
| Authors: | Palanisamy, Murugesan Manikkampatti Myneni, Venkata Ratnam Palaniyappan, Akilamudhan |
| Keywords: | Aqua regia;Bentonite Clay;EDXs;E-waste;Leached solution;Response surface methodolog |
| Issue Date: | Mar-2022 |
| Publisher: | CSIR-NIScPR, India |
| Abstract: | The present investigation focus on the recovery of copper (Cu) ions from printed circuit boards (PCBs) by applying simultaneous treatment of leaching and adsorption, as a novel approach. The PCBs are subjected to chemical leaching using aqua regia resulted in a Cu recovery of 97.06%. The leached solution is treated for removal of Cu with activated bent clay as an adsorbent. The optimum condition of process variables is found through central composite design-response surface methodology (RSM-CCD). The maximum %Cu removal of 97.33% is obtained at the optimum operating conditions of adsorbent size of 0.04 mm, adsorbent dosage of 3.5 g.L-1 and the temperature of 80C with 0.845 desirability. This investigation is found to be an eco-friendly way to recover copper ions and does not cause any environmental issues. |
| Page(s): | 157-165 |
| ISSN: | 0975-0991 (Online); 0971-457X (Print) |
| Appears in Collections: | IJCT Vol.29(2) [March 2022] |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| IJCT 29(2) 157-165.pdf | 1.49 MB | Adobe PDF | View/Open |
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