Please use this identifier to cite or link to this item: http://nopr.niscpr.res.in/handle/123456789/60110
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dc.contributor.authorSonak, Shreya S-
dc.contributor.authorPathare, Sandeep-
dc.contributor.authorModi, Siddharth J-
dc.contributor.authorKulkarni, Vithal M-
dc.date.accessioned2022-07-15T11:00:54Z-
dc.date.available2022-07-15T11:00:54Z-
dc.date.issued2022-07-
dc.identifier.issn2583-1321 (Online); 0019-5103 (Print)-
dc.identifier.urihttp://nopr.niscpr.res.in/handle/123456789/60110-
dc.description744-754en_US
dc.description.abstractAn increase in the number of invasive fungal infections especially in immunocompromised patients is increasing the mortality rate worldwide. Due to the emergence of drug-resistant fungi, the currently available antifungal drugs have become ineffective. Because no alternative treatment is available, some existing drugs are still used. Therefore, there is a need to design and develop novel and effective anti-fungal drugs. Molecular docking and 3-dimensional quantitative structure-activity relationship (3D-QSAR) methods have been useful approaches for the design of novel molecules. A set of 30 molecules reported in the literature containing azoles and non-azoles have been used in this study to derive 3DQSAR. CoMFA and CoMSIA models for the most active compound and least active compounds have been developed. The structural requirements were obtained by analysing the contour maps. The partial least square analysis for CoMFA and CoMSIA showed a significant cross-validated correlation coefficient of 0.625 and 0.67 and a non-cross validated correlation coefficient of 0.991 and 0.99, respectively. The model was validated by observing the predicted correlation for test molecules with the value of 0.699 and 0.659, respectively.en_US
dc.language.isoenen_US
dc.publisherNIScPR-CSIR, Indiaen_US
dc.sourceIJC Vol.61(07) [July 2022]en_US
dc.subjectAzolesen_US
dc.subjectAnti-fungalen_US
dc.subject3D-QSARen_US
dc.subjectCoMFAen_US
dc.subjectCoMSIAen_US
dc.titleDesign of anti-fungal agents by 3D-QSARen_US
dc.typeArticleen_US
Appears in Collections:IJC Vol.61(07) [July 2022]

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