Please use this identifier to cite or link to this item: http://nopr.niscpr.res.in/handle/123456789/60446
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dc.contributor.authorSharma, Meenu-
dc.contributor.authorPandita, Monika-
dc.contributor.authorShoket, Heena-
dc.contributor.authorBairwa, Narendra K-
dc.date.accessioned2022-09-01T06:34:21Z-
dc.date.available2022-09-01T06:34:21Z-
dc.date.issued2022-09-
dc.identifier.issn0975-1009 (Online); 0019-5189 (Print)-
dc.identifier.urihttp://nopr.niscpr.res.in/handle/123456789/60446-
dc.description667-671en_US
dc.description.abstractStress tolerance is a useful trait actively sought by the bioprocess industry for biofactories dealing with bioconversion of varied raw materials or carbon sources. Fungal or yeast species are useful in bioconversion and are sustainable bioresources for biochemicals and biofuel production. Genetic manipulation strategies are in practice to enhance the tolerance against stress agents for the improved bioconversion process. In this review, we highlight the importance of the F-box motif encoding genes and their interactions in imparting the stress tolerance phenotype to the yeast species. The F-box motif proteins constitute a part of the SCF-E3 ligase complex and are involved in the recruitment, and ubiquitination, followed by degradation of the substrate proteins by the 26S proteasome. It highlights the current scenario on the F-box motif encoding genes and their interaction partners as targets for the stress tolerance phenotype in the yeast and plant species and their utility in the bioconversion processes.en_US
dc.language.isoenen_US
dc.publisherNIScPR-CSIR,Indiaen_US
dc.sourceIJEB Vol.60(09) [Sep 2022]en_US
dc.subjectAbiotic stressen_US
dc.subjectBioconversionen_US
dc.subjectBrewer's Yeasten_US
dc.subjectGene-gene interactionsen_US
dc.subjectStress toleranceen_US
dc.subjectUbiquitin-proteasome system (UPS)en_US
dc.titleF-box motif encoding genes as targets for the development of stress-tolerant traits in Saccharomyces cerevisiaeen_US
dc.typeArticleen_US
dc.identifier.doihttps://doi.org/10.56042/ijeb.v60i09.65135en_US
Appears in Collections:IJEB Vol.60(09) [Sep 2022]

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