Please use this identifier to cite or link to this item: http://nopr.niscpr.res.in/handle/123456789/8335
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dc.contributor.authorDe, S S-
dc.contributor.authorGhosh, A K-
dc.contributor.authorGhosh, T K-
dc.contributor.authorJana, D-
dc.date.accessioned2010-04-26T04:55:28Z-
dc.date.available2010-04-26T04:55:28Z-
dc.date.issued2006-07-
dc.identifier.issn0975-1041 (Online); 0019-5596 (Print)-
dc.identifier.urihttp://hdl.handle.net/123456789/8335-
dc.description543-547en_US
dc.description.abstractA model has been developed to investigate the heat generation processes in semiconductor devices under heavily doped condition. The equilibrium between heat generation and heat dissipation by various mechanisms has been studied. The variations of heat dissipation with the change of carrier concentrations and the heat along the distance from the junction to the bulk have been estimated by numerical analyses. These are shown graphically with the results of an earlier work.en_US
dc.language.isoen_USen_US
dc.publisherCSIRen_US
dc.relation.ispartofseriesH01L21/00en_US
dc.sourceIJPAP Vol.44(07) [July 2006]en_US
dc.subjectThermal propertiesen_US
dc.subjectSemiconductor devicesen_US
dc.subjectEnergy conversionen_US
dc.titleEffective heating in heavily doped semiconductor devicesen_US
dc.typeArticleen_US
Appears in Collections:IJPAP Vol.44(07) [July 2006]

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